SiC Finishing Parts Manufacturer For IC Semiconductor

At HMT, we don't just supply SiC wafers – we engineer precision solutions for tomorrow’s technologies. While industry-standard As-cut SiC wafers typically measure 400μm, we empower your R&D and production with: Thickness Freedom: Break free from conventional limits with options ranging from 400μm to >1500μm – perfect for specialized applications requiring enhanced mechanical stability or ultra-thin profiles.

• Full Diameter Spectrum: Seamlessly scale from prototyping to mass production with 2" to 8" wafer configurations.

Whether you’re pushing boundaries in EV power systems, next-gen 5G infrastructure, or quantum computing, our customizable as-cut SiC wafers are your blueprint for success.

Applications

• Power ICs: SiC substrates for MOSFETs, Schottky diodes, and IGBTs.

• RF Devices: High-frequency MMICs for 5G base stations and radar systems.

• EV Components: Inverter-grade SiC wafers for automotive-grade power modules.

• Quantum Computing: Ultra-low-loss SiC parts for cryogenic environments.