HMT Delivers Precision SiC Wafer Customization Services

Whether you require specific SiC Subsrate thicknesses, unique dimensions, or superior quality control, HMT specializes in crafting As-Cut silicon carbide (SiC) wafers to meet your exact specifications. While standard As-Cut SiC wafers typically have a thickness of 600μm, we offer fully customizable solutions, including 900μm, 1000μm, 1200μm, or even >1500μm thickness options. Our capabilities span a wide range of wafer sizes, from 2-inch to 8-inch diameters, ensuring flexibility for diverse applications.

Why Choose HMT for SiC As-Cut Wafers?

• Precision Engineering: We guarantee strict quality control for critical parameters like TTV (Total Thickness Variation) BOW and WARP, ensuring optimal performance for your projects.

• Versatile Sizing: Choose from 2-inch, 4-inch, 6-inch, or 8-inch wafer diameters to match your technical requirements.

• Tailored Thickness: Break free from standard limits with custom thicknesses up to 1000μm+, designed for specialized industrial or research needs.

Boost Efficiency with Custom SiC Solutions

HMT’s as-cut SiC wafers are ideal for industries demanding high-performance semiconductor materials, including power electronics, EV systems, and advanced R&D. By partnering with us, you gain access to:

• Reduced development time with ready-to-integrate wafers.

• Enhanced durability for high-temperature and high-voltage environments.

• Cost-effective scalability for mass production or niche applications.
  
  

Unlock Your Project’s Potential Today!

Don’t settle for generic SiC wafers—optimize performance and efficiency with HMT’s tailored solutions. Contact us now to discuss your customization needs and discover how our expertise can elevate your next innovation.