4 inch SiC Boule

As the professional SiC Boule manufacturers and supplies, We can fabricate 4 inch D grade SiC Boule Ingot for laser cutting(cold split,water laser slicing), wire sawing, granding wheel and lapping plate machine's testing. Both 4 inch, 6 inch and 8 inch are available in HMT. The average thickness of SiC Boue Ingot about 15-20mm per PCS.

SiC the main application areas of SiC wafers are LED solid lighting and high frequency and high power devices. The material has several times higher than traditional silicon band gap, drift speed, breakdown voltage, thermal conductivity, high temperature resistance and other excellent characteristics, in high temperature, high pressure, high frequency, high power, photoelectric, radiation resistance, microwave and other electronic applications and aerospace, military, nuclear and other extreme environment applications have irreplaceable advantages. Especially in the field of electric vehicles and fast charging, which are now widely used by everyone. Therefore, it is called the third generation of semiconductor materials.