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HMT specializes in SiC Boule/Ingot manufacturing and as the supplies for the D Test Grade SiC Boule/Ingot for laser cutting testing.While multiwire sa...
HMT specializes in SiC ingot manufacturing and supplie test grade SiC ingot boule for laser cutting testing. While multiwire saw cutting is the mainstream method for SiC Boules, an increasing number of factories are opting for laser cutting as an alternative to traditional methods. Our test grade SiC Ingot Boules are specifically for equipment testing and is available at a significantly lower price. If you are interested in SiC ingot, please feel free to contact us now!
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Multi wire saw cutting machine is the use of diamond line one-way cycle or reciprocating cycle movement, so that the diamond line and the cutting object to form a relative grinding movement, so as to achieve the purpose of cutting. Diamond line is generally made of diamond powder and tungsten steel combined, because the hardness of diamond is 10, and the hardness of silicon carbide (SiC) is 9.5, the reciprocating grinding movement can barely achieve cutting.
The application for SiC Materials
SiC Wafer Manufacturer Production Analysis
Silicon Carbide SiC Wafer Polishing New Direction
SiC Boules and SiC Substrates industry chain
碳化硅晶锭切割方式
Contact: Mr.Kimrui
Phone: 15366208370
Tel: 15366208370
Email: kim@homray-material.com
Add: LiSheng Industrial Building, 60SuLi Road, WuZhong District, JiangSu Province, P.R.China.