Unpolished 2 inch SiC Wafer 400um 500um 600um

Homray Material Technology support customzied different thickness of unpolished 2 inch SiC wafers. What's is unpolished wafer? It means SiC wafer slicing from SiC Boule but without lapping and polishing process. We have various thickness of 2 inch As-cut SiC wafer，such as 400um 500um 600um 900um 1100um 1200um etc. Welcome to contact us and let us know your detailed requiremnts of SiC unpolished wafers.

Technical Parameters:

SiC with high voltage resistance, high temperature resistance, high frequency, radiation resistance and other excellent electrical characteristics, breaking through the physical limitations of silicon based semiconductor materials, is the third generation of semiconductor core materials.  SiC materials can be made into SiC based gallium nitride radio frequency devices and SiC power devices.  Benefiting from the development of 5G communications, national defense, new energy vehicles and new energy photovoltaic, SiC demand is growing at a considerable rate.